The Uppsala group ended up also able to undertake deposition of copper metallic by ALD making use of copper(I) chloride.23 In this instance, the copper metal was deposited on tantalum steel foils, working with an evaporation temperature of 350°C and also a deposition temperature range of 360°C– 410°C. The growth https://troyhtfco.blogdeazar.com/19995925/about-thin-film-deposition