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Sensor IC Substrate methods for Reliable Automotive Electronics functionality

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Introduction: Shengyi SI10U substrates using a 280°C Tg and ultra-small CTE enable resilient, precise automotive sensor ICs, supporting one-four layer custom made PCB assemblies for dependable MEMS sensor https://maxipcb.com/blog-detail/tailored-ic-substrate-options-to-support-mems-sensor-applications

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